Package on Package (PoP)

Package on Package (PoP)

Jetting underfill for PoP devices ensures high UPH with small wet-out zones and enables simultaneous underfill of top & bottom packages.

Package on Package (PoP) assembly has become essential for smartphone and tablet manufacturing to save on board space and allow reducing end application size. Typically, memory packages are stacked on top of the logic packages to reduce PCB surface area. Jetting enables simultaneous underfill of both the top & bottom packages to protect the assembly from shock & vibration.

Like CSP and BGA underfill, the keep out zone (KOZ) between PoP and other components becomes tighter with each subsequent generation. The ability to accurately dispense fluid for these packages becomes more critical. Nordson ASYMTEK continues to addresses these challenges with new technologies and products.

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Dan Ashley     
PCBA Market Specialist