No-flow underfill material is used to enhance the reliability of products containing flip chips and CSPs (chip scale packages) on printed circuit boards. Using no-flow underfill allows more flexibility in board design, as less space is required between the component requiring underfill and adjacent passive components.
No-flow underfill fluids can be dispensed with traditional needle dispensing but also jetted using the our award-winning, non-contact DispenseJet Series jet valve. Along with our Fluidmove software, the jet offers several methods, including shooting, dots on the fly, and jetting lines with patented co-axial air assist
We have been working with leading no-flow underfill fluid suppliers to develop applications that can be used in a variety of production environments. With the fastest jetting method—dots on the fly or line mode—dispense time can be is cut in half when compared to traditional needle dispensing (application dependant). Further benefits are realized from the non-contact features of the system, such as no touching of the board and no required underboard support.
When applying the no-flow underfill, the jet traverses a small distance (typically 1mm) above the and shoots the fluid onto the location. Depending on the accuracy and speed required in production, either in-line dots or lines are jetted.