3D packaging and assembly help utilize surface area and volume contained within a product. As more and more features are added, the surface of a PCB is densely populated to a point where actives & passive no longer fit onto a single surface. By embedding actives and passives beneath the surface of a PCB, more and more functionality can be added without need for increased PCB size. Nordson ASYMTEK offers dispensing solutions for a wide range of embedded assembly applications.
Embedded assembly dispensing solutions:
Jetting underfill between wall in recessed cavity and chip
Dispensing solder paste into recess where printing is not an option
- Jetting adhesives into recesses to help minimize passive movement.