Embedded Assemblies

By embedding actives and passives beneath the surface of a PCB, more functionality can be added without increased PCB size. Nordson ASYMTEK offers dispensing solutions for many embedded assembly applications

3D packaging and assembly help utilize surface area and volume contained within a product. As more and more features are added, the surface of a PCB is densely populated to a point where actives & passive no longer fit onto a single surface. By embedding actives and passives beneath the surface of a PCB, more and more functionality can be added without need for increased PCB size. Nordson ASYMTEK offers dispensing solutions for a wide range of embedded assembly applications.

Embedded assembly dispensing solutions:

  • Jetting underfill between wall in recessed cavity and chip
  • Dispensing solder paste into recess where printing is not an option
  • Jetting adhesives into recesses to help minimize passive movement.

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Dan Ashley     
PCBA Market Specialist