Consumer products such as gaming systems, laptop and netbook computers often require the use of corner or edge bonding fluids around the active components on the PCB. During transport or operation, the product is often subjected to mechanical forces like vibration or shock. By dispensing these fluids at the corner or along an edge of the BGA, the interconnect stress between component and PCB is minimized. Whether the fluid is dispensed before component placement “corner bond”, or after “edge bond”, automated fluid dispensing ensures accurate deposition at the highest production rates.