Corner and Edge Bonding from Nordson ASYMTEK

Corner and Edge Bonding

Corner and edge bonding are being used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs). Nordson ASYMTEK offers techniques for dispensing fluids for corner bonding

Consumer products such as gaming systems, laptop and netbook computers often require the use of corner or edge bonding fluids around the active components on the PCB.  During transport or operation, the product is often subjected to mechanical forces like vibration or shock. By dispensing these fluids at the corner or along an edge of the BGA, the interconnect stress between component and PCB is minimized.  Whether the fluid is dispensed before component placement “corner bond”, or after “edge bond”, automated fluid dispensing ensures accurate deposition at the highest production rates.

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Dan Ashley     
PCBA Market Specialist