Spectrum Dispensing Series

Featured Spectrum Series

S-822 Precision Stand Alone Semiconductor Dispenser
S-822 Precision Stand Alone Semiconductor Dispenser

The Spectrum™ S-822 Series fluid dispensing system is designed for semiconductor and electronics packaging applications, such as chip scale package (CSP) underfill, cavity fill, die attach, and encapsulation. S-822 is standalone with dual-shuttle stages

S-820-C Cleanroom Batch Semiconductor Dispenser
S-820-C Cleanroom Precision Batch Semiconductor Dispenser

The Spectrum S-820-C Class 100 Cleanroom dispenser is specifically designed for applications that are sensitive to contamination by submicronsized particles. The system provides advanced dispensing process capability, and is ideal for labs.

S-820B Precision Batch Semiconductor Dispenser
S-820B Precision Batch Semiconductor Dispenser

The Spectrum™ S-820B Series system is designed for batch production of semiconductor packaging processes, such as underfill, cavity fill, die attach, and encapsulation. It's ideal for labs, batch production, and new product development.

S-810 Precision Batch Dispensing for PCB Assembly and Microelectronics Packaging
S-810 Precision Batch Dispensing for PCB Assembly and Microelectronics Packaging

The Spectrum™ S-810 Series is designed for batch production of advanced dispensing applications that do not require substrate heat. The S-810 provides advanced dispensing process capability in an affordable package, and is ideal for labs.