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InterNepcon Japan

18 Jan 2012 - 20 Jan 2012

Booth: TBA
Type of Show: Product Assembly
Nordson Participants: Adhesive Product Assembly
Location: Tokyo Japan
Information: Maiko Matsumoto
Telephone:  +81.3.5762.2710 Ext.909
Email: Maiko.Matsumoto@nordson.com
Organizer Website: www.nepcon.jp/en/

 

Asia’s largest exhibition for electronics manufacturing and SMT.