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Event Calendar

Events

ExpoElectronica 2014
(15 Apr 2014-17 Apr 2014)

Expo Electronica 2014
(15 Apr 2014-17 Apr 2014)
Visit Nordson ASYMTEK in the Ostec booth at Expo Electronica - Moscow, Russia

ExpoElectronica, Moscow, Russia
(15 Apr 2014-17 Apr 2014)
ExpoElectronica, Moscow, Russia with our distributor Dipaul Technologies

SMT Nuremburg 2014
(16 Apr 2014-18 Apr 2014)

Plastic Japan
(16 Apr 2014-18 Apr 2014)
Tokyo, Japan - Booth# TBD

ICMD
(17 Apr 2014-20 Apr 2014)

CMEF China Medical Equipment Fair
(17 Apr 2014-20 Apr 2014)
Shenzhen, China

KPCA Show 2014
(22 Apr 2014-24 Apr 2014)
Visit Nordson MARCH with World Tech at Kintex, Korea - Booth E301

NEPCON China 2014
(23 Apr 2014-25 Apr 2014)
Visit Nordson YESTECH and Nordson DAGE in Booth No. B1F25

NEPCON CHINA 2014
(23 Apr 2014-25 Apr 2014)
Visit Nordson DAGE and Nordson YESTECH - Booth No. B-1F25

NEPCON China 2014
(23 Apr 2014-25 Apr 2014)
Come visit Nordson ASYMTEK at NEPCON China 2014 - Shanghai World Expo Exhibition & Convention Center - booth C-1G10

Chinaplas
(23 Apr 2014-26 Apr 2014)
Shanghai, China - Booth# German Pavillion & W2J01

ASC Spring
(28 Apr 2014-28 Apr 2014)

SMT Hybrid Packaging
(06 May 2014-08 May 2014)
Nordson DAGE X-ray and Bondtest systems will be on display in the 3D-MID Booth in Hall 7 - 601/603 and in Hall 6- Booth 213.

CONTROL 2014, Stuttgart, Germany
(06 May 2014-09 May 2014)
Nordson DAGE will exhibit their Materials Testing capabilities at Control Hall 1 -Stand No. 1724

SMT Hybrid Packaging 2014
(06 May 2014-08 May 2014)
Visit Nordson ASYMTEK with our partner, smartTec, at SMT Nuremberg, Germany: stand 7-219

SMT Nürnberg
(06 May 2014-08 May 2014)

SMT Hybrid Packaging 2014
(06 May 2014-08 May 2014)
Visit Nordson MARCH at Nuremberg, Germany, with Nordson DAGE in Booth #6-213 and our partner Quasys in Booth #7-521

Expo Plast
(07 May 2014-10 May 2014)
Lima, Peru - Booth# TBD

Interpack 2014
(08 May 2014-14 May 2014)
Nordson will have products on display including the Freedom hot melt system, hot melt applicators and other systems for specific packaging and case sealing applications.