Increase bond strength and prevent substrate distortion with superior control of adhesive fiber size, density and pattern width. 

Reduce adhesive consumption and improve product appearance with add-on rates as low as 1 gram per square meter at 1,000 feet per minute (300 mpm).

Minimize adhesive waste with edge control within ±2 mm without overspray.

Gain pattern flexibility with adhesive fiber sizes ranging from 50 to 100 microns.

Produce low-density large-fiber patterns for maximum bond strength, open patterns for absorbency, or highly dense fine-fiber patterns for heat-sensitive substrates.

Choose from nozzles in full- and partial-width designs, providing a high degree of pattern-width resolution.

Choose from three nozzles designs that include a 22.3-mm-wide SM200, 25-mm-wide Universal™ style, and 50-mm-wide SW200.

Produce right- or left-biased patterns with symmetrical Universal lamination nozzles.