New, advanced pattern control combines precise adhesive placement with easy-to-use, flexible design. The Eclipse Series EPC-30 Pattern Control represents a new direction in adhesive pattern control technology for packaging and product assembly applications. The advanced EPC-30 delivers flexible performance in an innovative, easy-to-use design that is simple to install and operate.

The position-based EPC-30 Pattern Control provides precise bead placement of constant and variable production speeds. With its ability to track line position within one millimeter, the EPC-30 can generate adhesive patterns at production speeds up to 300 m/mm (983 ft/min). The EPC-30 programs for quick, easy pattern changeovers to meet the demands of a diverse product line.

The EPC-30 Pattern Control is easy to set up and operate. Using just the operating and navigation keys, an operator can start the system, change programs, monitor system operation, check warning messages and make real-time adjustments to adhesive patterns. Operators can even adjust volume on-line, and can purge adhesive guns from the operator panel. The EPC-30 also takes the calculating out of such tasks as basic pattern setup and gun compensation.