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Dispensing Paste

SolderPlus® Solder Paste Our premium dispensing solder paste formulations support a wider array of solder applications than any other solder paste supplier. Beyond the regular offerings you would expect from any solder supplier, we offer specialized formulations for low-temperature and high-temperature reflow, leaded and lead-free alloys, in all flux types and alloy particle sizes. Whether you are soldering to stainless steel, assembling a flex circuit or anything in between, EFD makes a solder paste to meet your soldering needs. Find your formulation.
To better assist our customers in finding the right solder pastes for their applications, our solder paste formulations have been broken down into different categories called Families. Each family contains solder paste formulations with the characteristics needed to produce optimal results in specific applications.
General Purpose Clear Residue Enhanced Wetting Fine Pitch Low Residue Reduced Slump Restricted Residue Lead-free Shiny Fillet	Halide-free Difficult-to-Solder Surfaces Rapid Reflow Cycle Time (< 5 seconds) UV-traceable Pin transfer or Dipping (low viscosity) Extended Reflow Cycle Times (> 6 minutes) Gap Filling and/or Vertical Surfaces